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Your search returned 14 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components Packaging And Manufacturing Technology Part A
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Year : 1996 Volume number : 19 Issue: 04 |
Thermal Performance Of An Mcm Flip-Chip Assembly In Liquid Nitrogen
(Article)
Subject:
Thermal Management
,
Cryogenic Cooling
,
Thermal Distortion
Author:
Richard K.
Ulrich
Sanjay
Rajan
page:
451
-
457
Analysis Of Thermally Enhanced Soic Packages
(Article)
Subject:
Integrated Circuit
,
Finite Element Analysis
,
Thermal Performance
Author:
Bruce M.
Guenin
Edward J.
Derian
Richard L.
Groover
page:
458
-
468
Thermal Evaluation Of A Powerpc 620 Microprocessor In A Multiprocessor Computer
(Article)
Subject:
Electronic Cooling
,
Computational Fluid Dynamics
Author:
Henry
Wong
Tien-Yu Tom
Lee
page:
469
-
477
Development Of Jedec Standard Thermal Measurement Test Boards
(Article)
Subject:
Thermal Testing
,
Thermal Management
,
Thermal Modeling
Author:
Darvin
Edwards
page:
478
-
485
Design And Optimization Of Pin Fin Heat Sinks For Low Velocity Applications
(Article)
Subject:
Pin
,
Design Optimisation
,
Electronic Cooling
Author:
H.
Shaukatullah
Wayne R.
Storr
Michael A.
Gaynes
page:
486
-
494
Design Considerations For Air Cooling Electronic Systems In High Altitude Conditions
(Article)
Subject:
Altitude
,
Temperature
,
Turbulent
,
Laminar
Author:
Christian
Belady
page:
495
-
500
Three Dimensional Thermal Modeling Based On The Two Port Network Theory For Hybrid Or Monolithic Integrated Power Circuits
(Article)
Subject:
Thermal Design
,
Transient Thermal Modelling
Author:
Jean-Marie
Dorkel
Patrick
Tounsi
Philippe
Leturcq
page:
501
-
507
Improving The Frequency Response Of Ceramic Dielectrics For High Power Applications In Power Electronic Converters
(Article)
Subject:
Ceramic Power Capacitors
,
Ferroelectric Capacitors
Author:
Colin K.
Campbell
Jacobus Daniel
Van Wyk
page:
508
-
515
Wafer Through-Hole Interconnections With High Vertical Wiring Densities
(Article)
Subject:
Microsystems
,
Electrodeposited
,
Feedthroughs
Author:
Carsten
Christensen
Siebe
Bouwstra
page:
516
-
522
Development Of Modular Products
(Article)
Subject:
Modular Products
,
Fuzzy Neural Network
,
Multichip-On-Oxide (Mco)
Author:
Andrew
Kusiak
Chun-Che
Huang
page:
523
-
538
A Closed Form Solution Of Junction To Substrate Thermal Resistance In Semiconductor Chips
(Article)
Subject:
Thermal Resistance
,
Heat Spreading
,
Spreading Rate
Author:
Francesc N.
Masana
page:
539
-
545
Mechanism Of Electrical Conduction Through Anisotropically Conductive Adhesive Films
(Article)
Subject:
Anisotropically Conductive Adhesive Film
,
Flexible Printed Circuit
,
Indium Tin Oxide
Author:
Masuo
Mizuno
Masumi
Saka
page:
546
-
553
Laser Linking Of Metal Interconnect Linking Dynamics And Failure Analysis
(Article)
Subject:
Laser
,
Laser Linking
,
Laser Processing
Author:
Roy L.
Rasera
Joseph B.
Bernstein
page:
554
-
561
In-Process Board Warpage Measurement In A Lab Scale Wave Soldering Oven
(Article)
Subject:
Shadow Method
,
Fringing Reef
,
Simulation
Author:
Michael R.
Stiteler
Brian
Leutz
I. Charles
Ume
page:
562
-
570
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